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Molecular dynamics study of thermally induced shear strain in nanoscale copper

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2 Author(s)
Heino, P. ; Inst. of Electron., Tampere Univ. of Technol., Finland ; Ristolainen, E.

Thermally induced strain and stress were calculated in a nanoscale copper system using the molecular dynamics method. The shear strain in the system was generated by a mismatch in the coefficients of thermal expansion between the materials surrounding it. Plastic deformation mechanisms, stress concentration and stress relaxation were studied. The results show that initially the stress is concentrated in the corners of the system, as suggested by other studies. However, when the structure has been plastically deformed, high stress regions are found in the center of the system

Published in:

Advanced Packaging, IEEE Transactions on  (Volume:22 ,  Issue: 3 )

Date of Publication:

Aug 1999

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