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Packaging properties of ALIVH-CSP using SBB flip-chip bonding technology

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8 Author(s)
Itagaki, M. ; Device Eng. Dev. Center, Matsushita Electr. Ind. Co. Ltd., Osaka, Japan ; Amami, K. ; Tomura, Y. ; Yuhaku, S.
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A new chip scale package (CSP) using an organic laminated substrate called μCSP was developed, which was fabricated using ALIVH substrate as a interposer and stud-bump-bonding (SBB) flip-chip technology. The ALIVH substrate is a multilayered organic substrate with inner via holes in any layer. The newly developed CSP-L using ALIVH substrate realized a miniaturization of its package size to the same as a CSP using a ceramic substrate (CSP-C). In order to perform the SBB flip-chip bonding onto the ALIVH substrate, an excellent coplanarity of the substrate surface was required. The required coplanarity was obtained using a fixture during the SBB flip-chip bonding process. The first-level packaging reliability and the second-level packaging reliability onto ALIVH mother board were evaluated. The resulting reliabilities were good enough to apply to practical use

Published in:

Advanced Packaging, IEEE Transactions on  (Volume:22 ,  Issue: 3 )