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Electrical characterization of integrated circuit molding compound

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4 Author(s)
Green, C.C. ; Dept. of Electr. & Comput. Eng., Arizona Univ., Tucson, AZ, USA ; Seligman, J.M. ; Prince, J. ; Virga, K.L.

Broadband dielectric characterization techniques were applied to a novolac epoxy molding compound used in the integrated circuit industry. Both dielectric loss tangent and relative dielectric constant were determined over the frequency range from 100 MHz to 1.4 GHz, using two independent measurement methods. The molding compound was in “as-molded condition”, which resembles the use conditions for the material

Published in:

Advanced Packaging, IEEE Transactions on  (Volume:22 ,  Issue: 3 )