Referenced Items are not available for this document.
Power and ground planes are required to have low impedance over a wide range of frequencies. Parallel ground and power planes in multilayer printed-circuit boards exhibit multiple resonances, which increase the impedance and also the radiation from the edge of the board. Resistive termination along the board edges reduces the resonance peaks. Simple and straightforward design expressions, simulated self and transfer impedances, as well as measured impedance plots are presented for power-ground planes
Published in:
Advanced Packaging, IEEE Transactions on
(Volume:22
,
Issue:
3
)
Date of Publication: Aug 1999
- Page(s):
- 274 - 283
- ISSN :
- 1521-3323
- INSPEC Accession Number:
- 6361480
- Digital Object Identifier :
- 10.1109/6040.784475
- Product Type:
- Journals & Magazines
- Date of Current Version :
- 06 August 2002
- Issue Date :
- Aug 1999
- Sponsored by :
- IEEE Components, Packaging, and Manufacturing Technology Society
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