Close category search window
 

Bi/sub 2/Sr/sub 2/CaCu/sub 2/O/sub 8+/spl delta// intrinsic Josephson junctions fabricated by a simple technique without photolithography

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

11 Author(s)
Feng, Y.J. ; Dept. of Electron. Sci. & Eng., Nanjing Univ., China ; Shan, W.L. ; Jin, M. ; Zhou, J.
more authors

Due to the roughness in the surface of the crystal sample, it is hard to use photolithography in the patterning process of the Bi/sub 2/Sr/sub 2/CaCu/sub 2/O/sub 8+/spl delta// intrinsic Josephson junction. In this paper, we report a simple technique for fabricating the Bi/sub 2/Sr/sub 2/CaCu/sub 2/O/sub 8+/spl delta// intrinsic Josephson junctions. In the patterning process, metal masks are used instead of photolithography and argon ion milling is applied to form a small mesa on the Bi/sub 2/Sr/sub 2/CaCu/sub 2/O/sub 8+/spl delta// crystal surface. Real four-probe transport measurements are made on the Bi/sub 2/Sr/sub 2/CaCu/sub 2/O/sub 8+/spl delta// intrinsic junctions and typical current-voltage characteristics with multi-branch structure have been observed, from which the superconducting gap parameter can be extracted. Additionally, from the strung hysteresis in the I-V characteristics, the capacitance C/sub J/ of the unit intrinsic Josephson junction can be estimated, which is in good agreement with that evaluated from the geometric parameters of the unit junction between the two copper oxide lagers.

Published in:
Applied Superconductivity, IEEE Transactions on  (Volume:9 ,  Issue: 2 )

Date of Publication: June 1999

Need Help?


IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2013 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.