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Effect of thermal noise on the bit error rate of SFQ devices

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4 Author(s)
Kang, J.H. ; Northrop Grumman STC, Pittsburgh, PA, USA ; Przybysz, J.X. ; Worsham, A.H. ; Miller, D.L.

To measure the effect of thermal noise on switching a Josephson junction to the voltage state a simple SFQ circuit constructed with resistively shunted Nb/AlO/sub x//Nb junctions was used. Based on a good agreement between the measured data and the thermal activation theory, the effect of thermal noise on the bit error rate of SFQ devices was studied, The effective thermal noise temperature of 10 K used to fit the data was higher than the bath temperature of 4.2 K. Careful circuit design to get large critical margins is necessary to achieve high operating temperature of SFQ logic devices.

Published in:

Applied Superconductivity, IEEE Transactions on  (Volume:9 ,  Issue: 2 )

Date of Publication:

June 1999

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