By Topic

A novel approach to chip-to-chip communication using a single flux quantum pulse

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$33 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

3 Author(s)
M. Maezawa ; Electrotech. Lab., Ibaraki, Japan ; H. Yamamori ; A. Shoji

A novel approach to chip-to-chip communication for RSFQ technology is proposed. The main idea is to fabricate Josephson junctions on a substrate for multi-chip packaging, which equips the substrate as well as the chip with built-in active drivers and receivers. The driver on the chip is connected directly to the receiver on the substrate through a connector which can be considered as a lumped circuit element. Because the circuit is free from the impedance matching constraint, broadband chip-to-chip data transfer with wide operating margins will be realized. We have designed, simulated and optimized a chip-to-chip single flux quantum (SFQ) pulse transfer circuit. For a connector inductance of 20 pH, the bias current margins and the maximum throughput have been calculated to be /spl plusmn/24% and above 50 Gb/s, respectively.

Published in:

IEEE Transactions on Applied Superconductivity  (Volume:9 ,  Issue: 2 )