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High performance packaging system for superconducting electronics

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2 Author(s)
Gaidarenko, D. ; HYPRES, Elmsford, NY, USA ; Robertazzi, R.

We demonstrate a packaging system/test probe suitable for testing complex, large scale superconducting integrated circuits with thousands of Josephson junctions. The cryopackage is designed to work with a 1 cm superconducting die, with liquid He immersion cooling using a standard storage dewar. The package has 80 high-speed input-output lines (DC to 20 GHz) which connect the chip to room temperature electronics. The tip of the cryopackage, containing the chip, is shielded from the ambient magnetic field with two mumetal cylinders and contains a built-in coil, which provides in-situ degaussing of the inner shield. To clear flux trapped in the chip being tested, the probe contains a novel gas manifold and a system of heaters. During the defluxing operation, a heater evaporates liquid helium inside the chip enclosure, the expanding vapor purging the liquid from the sample cell and warming the chip above its transition temperature. Once the chip is defluxed, the liquid helium is allowed back into the cell, at a rate slow enough to avoid trapping flux in the chip while it is cooled. The process can be automated and does not require any movement of the probe once inserted in the dewar.

Published in:

Applied Superconductivity, IEEE Transactions on  (Volume:9 ,  Issue: 2 )

Date of Publication:

June 1999

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