Cart (Loading....) | Create Account
Close category search window

Quench characteristics of Bi-2223 coil at liquid helium temperature

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

7 Author(s)
Oh, S.S. ; Lab. of Appl. Supercond., Korea Electrotechnol. Res. Inst., Changwon, South Korea ; Wang, Q.L. ; Ha, H.S. ; Jang, H.M.
more authors

The quench characteristics of Bi-2223 single and four double pancake coils operating at liquid helium temperature were investigated based on experiments and numerical simulations. Broad resistive transition was observed in the double pancake coils. The Bi-2223 double pancake coil operating at liquid helium showed a slow normal zone propagation velocity. The stability margin of the coil was confirmed to be high because of the low operating temperature and a good cooling condition. The quench characteristics of a four double pancake coil system was simulated by a numerical method. It is clear that the protection resistance has a great influence on the current decay, transient voltage and hot-spot temperature.

Published in:

Applied Superconductivity, IEEE Transactions on  (Volume:9 ,  Issue: 2 )

Date of Publication:

June 1999

Need Help?

IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.