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Modular testprocessor for VLSI chips and high-density PC boards

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1 Author(s)
Budde, W.O. ; Rheinisch Westfalischen Tech. Sch., Aachen, West Germany

A method for the test of VLSI chips and high-density PC boards is proposed. A built-in, microprogrammable test controller, called a testprocessor, applied tests to all separately testable blocks within either a VLSI chip or PC board, hence increasing controllability and observability. Facilities for test-pattern storage and test-result evaluation as well as means for test-pattern generation and response compaction are provided; consequently, most tasks commonly associated with an external test equipment can be covered by the testprocessor. In contrast to most concepts of built-in test known to date, the testprocessor support tests of all kinds (structural, functional, pseudorandom), applied serially or in parallel; furthermore, adaptation to standardized test interfaces can easily be achieved. The concept is intended to simplify wafer test, production test, and testing burn-in, and it supports field maintenance and system self-test

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Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on  (Volume:7 ,  Issue: 10 )