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A novel design concept for a super compact power amplifier module (SCPAM) using a multilayer substrate

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6 Author(s)
M. Nishida ; Microelectron. Res. Center, Sanyo Electr. Co. Ltd., Osaka, Japan ; S. Murai ; S. Banba ; T. Yamaguchi
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This paper presents a novel circuit and layout design concept for a Super Compact Power Amplifier Module (SCPAM) using a multilayer substrate. This concept enables miniaturization of the module, while continuing to allow easy design and good performance. A 0.04 cc 1 W class module for mobile communication systems is demonstrated. A 0.02 cc module including this concept is also proposed.

Published in:

Microwave Symposium Digest, 1999 IEEE MTT-S International  (Volume:3 )

Date of Conference:

13-19 June 1999