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CAD-oriented equivalent circuit modeling of on-chip interconnects for RF integrated circuits in CMOS technology

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4 Author(s)
J. Zheng ; Dept. of Electr. & Comput. Eng., Oregon State Univ., Corvallis, OR, USA ; Y. -C. Hahm ; A. Weisshaar ; V. K. Tripathi

A CAD-oriented modeling methodology for coupled interconnects on lossy substrates in CMOS technology is presented. The modeling technique is based on a quasi-static EM analysis and an equivalent circuit model extraction and model-order reduction procedure. The response of the SPICE compatible equivalent circuit models is in good agreement with the frequency-dependent transmission line characteristics of the interconnects.

Published in:

Microwave Symposium Digest, 1999 IEEE MTT-S International  (Volume:1 )

Date of Conference:

13-19 June 1999