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A CAD-oriented modeling methodology for coupled interconnects on lossy substrates in CMOS technology is presented. The modeling technique is based on a quasi-static EM analysis and an equivalent circuit model extraction and model-order reduction procedure. The response of the SPICE compatible equivalent circuit models is in good agreement with the frequency-dependent transmission line characteristics of the interconnects.
Microwave Symposium Digest, 1999 IEEE MTT-S International (Volume:1 )
Date of Conference: 13-19 June 1999