Cart (Loading....) | Create Account
Close category search window
 

Electrical characterization of POLYHIC, a high density, high frequency, interconnection and packaging medium for digital circuits

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

6 Author(s)

A family of multilayer hybrid integrated circuits called POLYHIC is discussed. The circuits use thin-film technology on an alumina substrate with triazine-based, photodefinable, polymer dielectric layers. This family provides high-interconnection-density packages with desirable electrical properties. High-frequency applications exploit the ability of this package to provide a controlled-impedance, low-loss environment with terminations very close to the silicon devices. A program was conducted to characterize transmission line effects for high-data-rate applications of the package. The results are presented as design capabilities, based on the conductor and dielectric properties, that will ensure required product characteristic impedance and attenuation factors. Single-ended and coupled-pair transmission lines are discussed. The package's dependence on electrical properties as a function of key parameters is examined. Experimental verification of pulse behavior is presented. The POLYHIC family can support high-fidelity pulses at typical data rates of more than 2 Gb/s with signal risetimes of 100 ps

Published in:

Electronic Components Conference, 1989. Proceedings., 39th

Date of Conference:

22-24 May 1989

Need Help?


IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.