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Failure and yield analysis of fabrication process of 155 Mbps optical transmitter modules

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6 Author(s)
Nam Hwang ; ETRI-Microelectron. Technol. Lab., Taejon, South Korea ; Gwan-Chong Joo ; Sang-Hwan Lee ; Hee-Tae Lee
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The failure and yield on the preliminary result of our pioneer fabrication line of 155 Mbps OTMs adopting a modern Si V-groove and FCB techniques have been studied. The yields of LD purge, sub-module assembly, and final assembly were found to be 78%, 95%, and 77% respectively out of total 319 samples. The yield of whole fabrication process has been found to be 57%, where it can be improved to be 70% or higher by replacing the electrical component assembly process with more advanced IC process

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Electronic Components and Technology Conference, 1999. 1999 Proceedings. 49th

Date of Conference:

1999