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Pole-residue formulation for transient simulation of high-speed interconnects using Householder LS curve-fitting techniques

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4 Author(s)
Elzinga, M. ; Dept. of Electr. & Comput. Eng., Arizona Univ., Tucson, AZ, USA ; Virga, K.L. ; Li Zhao ; Prince, J.

As digital circuits approach the GHz range, and as the need for high performance wireless devices increases, new simulation tools which accurately characterize high speed interconnects are needed. In this paper, a new macromodelling algorithm for time domain simulation of interconnects is presented. The algorithm incorporates Householder LS curve-fitting techniques. The approach generates a universal macromodelling tool that enables simulation of interconnects in a modified version of SPICE. This results in a method that conveniently incorporates accurate EM models of interconnects, or experimental data into a circuit simulator. The time domain simulation results using this new tool are compared with results from other simulators

Published in:

Electronic Components and Technology Conference, 1999. 1999 Proceedings. 49th

Date of Conference:

1999