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An overview of manufacturing yield and reliability modeling for semiconductor products

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2 Author(s)
Way Kuo ; Zachry Eng. Center, Texas A&M Univ., College Station, TX, USA ; Taeho Kim

This paper presents an overview of yield, reliability, burn-in, cost factors, and fault coverage as practiced in the semiconductor manufacturing industry. Reliability and yield modeling can be used as a foundation for developing effective stress burn-in, which in turn can warranty high-quality semiconductor products. Yield models are described and their advantages and disadvantages are discussed. Both yield reliability relationships and relation models between yield and reliability are thoroughly analyzed in regard to their importance to semiconductor products

Published in:

Proceedings of the IEEE  (Volume:87 ,  Issue: 8 )

Date of Publication:

Aug 1999

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