By Topic

Experiments on low velocity cooling of high conductivity substrates

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$33 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

3 Author(s)
K. K. Sikka ; IBM Corp., Hopewell Junction, NY, USA ; K. E. Torrance ; T. S. Fisher

Experiments are reported on low velocity cooling of a heater-on-substrate geometry for high conductivity substrate materials. Four different substrate materials were studied: 1) aluminum 6061-T6; 2) aluminum nitride; 3) alumina; 4) FR-4. The effects of combined buoyancy and forced air flow, geometric orientation, substrate size, thermal conductivity, and emittance on heat transfer are evaluated. Results define the performance of the substrates and the limits of conjugate mixed convection for horizontal substrates, and of orientation effects for substrates tilted from buoyancy-opposing to buoyancy-assisting orientations. An analytical approximation is described that predicts the experimental data with good accuracy over broad parameter ranges

Published in:

IEEE Transactions on Components and Packaging Technologies  (Volume:22 ,  Issue: 2 )