Cart (Loading....) | Create Account
Close category search window
 

Normal current density effect in RF-discharge according to results of two-dimensional numerical modeling

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

2 Author(s)
Raizer, Yu.P. ; Inst. of Problems in Mech., Acad. of Sci., Moscow, Russia ; Shneider, M.N.

For the first time, the normal density effect is demonstrated by modeling a two-dimensional cylindrical column of a moderate pressure RF-discharge operating in the α-regime. When the current increases, the discharge column is expanded, with the current density and voltage on the electrodes being unchanged. It is clarified why the boundary between currentless and current (filled with plasma) regions is stabilized. Outside the plasma zone, the gas temperature and the gas density at constant pressure are lower (no Joule's energy release) than those in the plasma zone, therefore the normal voltage is not sufficient to maintain plasma there. It is shown that simple one-dimensional models give quite reasonable results for parameters of the normal discharge

Published in:

Plasma Science, IEEE Transactions on  (Volume:27 ,  Issue: 3 )

Date of Publication:

Jun 1999

Need Help?


IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.