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A method of quantitative defect analysis and yield forecast by an advanced kill rate from line monitoring data

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2 Author(s)
H. Kikuchi ; ULSI Device Div. Labs., NEC Corp., Sagamihara, Japan ; N. Nishio

This paper presents a method for quantitative defect analysis and yield forecast by using a new kill rate from line monitoring data. This kill rate is based on the average of kill rates from dice with the same numbers of the same type of defect occurrences on a die. A simulation study indicated that this new method is superior to conventional methods for multiple defect occurrences on a die

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Statistical Metrology, 1999. IWSM. 1999 4th International Workshop on

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