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A high fill-factor infrared bolometer using micromachined multilevel electrothermal structures

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7 Author(s)
Hyung-Kew Lee ; Dept. of Electr. Eng., Korea Adv. Inst. of Sci. & Technol., Seoul, South Korea ; Jun-Bo Yoon ; Euisik Yoon ; Sang-Baek Ju
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A high fill-factor uncooled infrared (IR) bolometer has been fabricated by using thin-film titanium resistors sandwiched in a surface-micromachined silicon oxinitride membrane (50 μm×50 μm). This bolometer is realized in multilevel electrothermal structures with a fill-factor over 92%. From the multilevel structure, thermal isolation can be independently optimized without sacrificing IR absorbing area. Initial measurements show a thermal time constant of 12 ms, a responsivity of 1600 V/W, and a detectivity (D*) of 5×108 cm√Hz/W

Published in:

Electron Devices, IEEE Transactions on  (Volume:46 ,  Issue: 7 )

Date of Publication:

Jul 1999

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