Cart (Loading....) | Create Account
Close category search window
 

A high fill-factor infrared bolometer using micromachined multilevel electrothermal structures

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

7 Author(s)
Hyung-Kew Lee ; Dept. of Electr. Eng., Korea Adv. Inst. of Sci. & Technol., Seoul, South Korea ; Jun-Bo Yoon ; Euisik Yoon ; Sang-Baek Ju
more authors

A high fill-factor uncooled infrared (IR) bolometer has been fabricated by using thin-film titanium resistors sandwiched in a surface-micromachined silicon oxinitride membrane (50 μm×50 μm). This bolometer is realized in multilevel electrothermal structures with a fill-factor over 92%. From the multilevel structure, thermal isolation can be independently optimized without sacrificing IR absorbing area. Initial measurements show a thermal time constant of 12 ms, a responsivity of 1600 V/W, and a detectivity (D*) of 5×108 cm√Hz/W

Published in:

Electron Devices, IEEE Transactions on  (Volume:46 ,  Issue: 7 )

Date of Publication:

Jul 1999

Need Help?


IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.