By Topic

Silicon micromachined ultrasonic transducers

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

7 Author(s)
Khuri-Yakub, B.T. ; Edward L. Ginzton Lab., Stanford Univ., CA, USA ; Degertekin, F.L. ; Jin, X.-C. ; Calmes, S.
more authors

This paper reviews ultrasonic transducers that are made by silicon micromachining (MUTs). Transducers for both air-borne and immersion applications are made from parallel plate capacitors whose dimensions are controlled through traditional integrated circuit manufacturing methods. Typical dimensions of the capacitors are: gap <1 micron (vacuum or air), membrane thickness=1 micron (silicon nitride or poly-silicon), and diameter=50 microns. A large number of small elements are connected in parallel to make a transducer. Transducers for air borne ultrasound applications have been operated in the frequency range of 0.1-11 MHz, while immersion transducers have been operated in the frequency range of 1-20 MHz. A theoretical model for the transducers will be presented. The model is used to highlight the important parameters in the design of both airborne and immersion transducers. Theory is used to compare the receive sensitivity, the transmit power capability, and the bandwidth of the MUTs to piezoelectric transducers. We will show that MUTs are at least as good if not better performing than piezoelectric transducers. Examples of single element transducers, linear array transducers, and two dimensional arrays of transducers will be presented. The agreement between the theory and experimental measurements will be presented and will prove the validity of the model. In summary, we will present a capacitive micromachined transducer technology that is competitive to the piezoelectric technology and that carries the advantage of electronic integration and batch processing using silicon fabrication practices

Published in:

Ultrasonics Symposium, 1998. Proceedings., 1998 IEEE  (Volume:2 )

Date of Conference: