By Topic

Control charts for random and fixed components of variation in the case of fixed wafer locations and measurement positions

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

2 Author(s)
Kil-Soo Kim ; Dept. of Ind. Eng., Korea Adv. Inst. of Sci. & Technol., Seoul, South Korea ; Bong-Jin Yum

In such processes as wafer-grinding and LPCVD, the variation within a group of measurements is traceable to various causes, and therefore, needs to be decomposed into relevant components of variation for an effective equipment monitoring and diagnosis. In this article, an LPCVD process is considered as an example, and control charting methods are developed for monitoring various fixed and random components of variation separately. For this purpose, the structure of measurement data (e.g., thickness) is described by a split-unit model in which two different sizes of experimental units (i.e., the wafer location as a whole unit and the measurement position as a split unit) are explicitly recognized. Then, control charts are developed for detecting unusual differences among fixed wafer locations within a batch and fixed measurement positions within a wafer. Control charts for the overall process average and random error variations are also developed, and the proposed method is illustrated with an example

Published in:

Semiconductor Manufacturing, IEEE Transactions on  (Volume:12 ,  Issue: 2 )