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bibliography of liquid cooled heat sinks for thermal enhancement of electronic packages

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1 Author(s)
Shaukatullah, H. ; Div. of Storage Syst., IBM Corp., Tucson, AZ, USA

A bibliography of 225 publications dealing with liquid cooled heat sinks for thermal enhancement of electronic packages is presented. The bibliography also includes papers dealing with design and performance analysis of heat sinks and extended surfaces cooled with liquids. The papers are arranged in several categories.

Published in:
Semiconductor Thermal Measurement and Management Symposium, 1999. Fifteenth Annual IEEE

Date of Conference: 9-11 March 1999

Page(s):
231 - 245
Meeting Date :
09 Mar 1999-11 Mar 1999
ISSN :
1065-2221
Print ISBN:
0-7803-5264-5
INSPEC Accession Number:
6319776
Conference Location :
San Diego, CA, USA
Digital Object Identifier :
10.1109/STHERM.1999.762454
Product Type:
Conference Publications

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