Low dielectric constant new materials for multilayer ceramic substrate

A low-dielectric-constant glass-ceramic material system with improved thermal expansion coefficient and flexural strength is described. This material system consists of quartz glass, cordierite, and borosilicate glass. It can be sintered at temperatures below 1000 degrees C, making it possible to use low-electrical-resistivity conductors, for example, Au, Ag, Ag-Pd, and Cu, as signal lines and interconnections. A dielectric constant in the 3.9 to 4.7 range can be realized. The thermal expansion coefficient can be controlled to match that of the chips carried. The flexural strength (2000 kg/cm/sup 2/) is relatively high. Using green-sheet-lamination technology, a low-dielectric-constant multilayer glass-ceramic substrate with Ag-Pd wiring, suitable for use as a substrate for a high-speed VLSI multichip package, was developed.<
>