Cart (Loading....) | Create Account
Close category search window
 

Accurate on-chip interconnect evaluation: a time-domain technique

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

4 Author(s)
Soumyanath, K. ; Intel Corp., Hillsboro, OR, USA ; Borkar, S. ; Chunyan Zhou ; Bloechel, B.A.

This paper describes an on-chip sampling and measurement technique for accurate (<15 ps) evaluation of interconnect delays and coupled noise. We have used this nonintrusive time-domain technique to extract in situ driver/receiver waveforms, propagation delays, and coupled noise in 120 interconnect structures. The effects studied include multiple AC returns through active devices, gridded planes on adjacent layers, via impedances, variable driver impedances, and noise in bus structures. The results provide a comprehensive evaluation of interconnect delays and noise in a 1.8 V, 0.25 μm process

Published in:

Solid-State Circuits, IEEE Journal of  (Volume:34 ,  Issue: 5 )

Date of Publication:

May 1999

Need Help?


IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.