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Parametric analysis of improved planar balun circuits for wireless microwave and RF applications

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3 Author(s)
Preetham Kumar, B. ; Dept. of Electr. & Comput. Eng., California Univ., Davis, CA, USA ; Branner, G.R. ; Huang, B.

The high frequency balun network is a vital component in the realization of certain RF and microwave system topologies, especially in wireless communication system architectures. This paper describes an in-depth parametric analysis of two planar balun circuits operating in the 900 MHz wireless band. The novel feature of the designs are their compact size which is almost one-tenth of the standard λ/4 coupled line design. Coupling levels for the two designs are ~6 dB (with broader bandwidth) for Model 1 and ~3 dB (with narrower bandwidth) for Model 2. Computed and measured data are presented for coupling performance, and dimensional parametric analysis

Published in:

Circuits and Systems, 1998. Proceedings. 1998 Midwest Symposium on

Date of Conference:

9-12 Aug 1998

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