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Efficient techniques for accurate modeling and simulation of substrate coupling in mixed-signal IC's

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3 Author(s)
Costa, J.P. ; Dept. of Electr. & Comput. Eng., Inst. Superior Tecnico, Lisbon, Portugal ; Mike Chou ; Silveira, L.M.

Industry trends aimed at integrating higher levels of circuit functionality have triggered a proliferation of mixed analog-digital systems. Magnified noise coupling through the common chip substrate has made the design and verification of such systems an increasingly difficult task. In this paper we present a fast eigendecomposition technique that accelerates operator application in BEM methods and avoids the dense-matrix storage while taking all of the substrate boundary effects into account explicitly. This technique can be used for accurate and efficient modeling of substrate coupling effects in mixed-signal integrated circuits

Published in:

Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on  (Volume:18 ,  Issue: 5 )

Date of Publication:

May 1999

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