By Topic

Recent Japanese developments in printed wiring boards for SMT

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

2 Author(s)
Takagi, K. ; Furukawa Electr. Co. Ltd., Japan ; Yasufuku, S.

Recent developments in printed wiring boards (PWBs) for use in surface mounting technology (SMT) in Japan are reviewed. Particular emphasis is placed on the high-density multilayer PWBs, which are important for SMT. Requirement for PWBs with respect to wiring density and housing capability, electrical properties, characteristics required at time of mounting, and reliability are discussed. Design, structure, and substrate materials are examined. The manufacture process is described. Quality assurance is addressed. Future prospects for PWBs are considered.<>

Published in:

Electrical Insulation Magazine, IEEE  (Volume:7 ,  Issue: 2 )