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Recent Japanese developments in printed wiring boards for SMT

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2 Author(s)
Takagi, K. ; Furukawa Electr. Co. Ltd., Japan ; Yasufuku, S.

Recent developments in printed wiring boards (PWBs) for use in surface mounting technology (SMT) in Japan are reviewed. Particular emphasis is placed on the high-density multilayer PWBs, which are important for SMT. Requirement for PWBs with respect to wiring density and housing capability, electrical properties, characteristics required at time of mounting, and reliability are discussed. Design, structure, and substrate materials are examined. The manufacture process is described. Quality assurance is addressed. Future prospects for PWBs are considered.<>

Published in:

Electrical Insulation Magazine, IEEE  (Volume:7 ,  Issue: 2 )

Date of Publication:

March-April 1991

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