By Topic

Crystallization of electroless Ni-P under bump metallization induced by solder reaction

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

4 Author(s)
Jang, J.W. ; Dept. of Mater. Sci. & Eng., California Univ., Los Angeles, CA, USA ; Kim, P.G. ; Tu, K.N. ; Frear, D.R.

Solder reaction-assisted crystallization of electroless Ni-P under bump metallization in the Si/SiO2/Al/Ni-P/63Sn-37Pb multilayer structure was analyzed using transmission electron microscopy, scanning electron microscopy, energy dispersive X-ray, and electron probe microanalysis. The electroless Ni-P had an amorphous structure and a composition of Ni85P15 in the as-plated condition. Upon reflow, the electroless Ni-P transformed to Ni 3Sn4 and Ni3P. The crystallization of electroless Ni-P to Ni3P was induced by Ni depletion from electroless Ni-P to form Ni3Sn4. The crystallization kinetics were found to be diffusion-controlled

Published in:

Advanced Packaging Materials: Processes, Properties and Interfaces, 1999. Proceedings. International Symposium on

Date of Conference:

14-17 Mar 1999