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ShellCase ultrathin chip size package

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1 Author(s)
Badihi, A. ; ShellCase, Jerusalem

As the demand for ever-smaller electronic and optical devices grows, manufacturers are seeking ways to reduce IC size and weight. A fully packaged integrated circuit can now be as small and thin as the chip itself. The chip size package (CSP) is fundamentally changing the way electronic products are being designed. The ShellCase CSP, for peripheral, area array and BGA applications and for optical applications, is distinguished by its ultra-thin profile, its reliability, and its cost-effective wafer-level process

Published in:

Advanced Packaging Materials: Processes, Properties and Interfaces, 1999. Proceedings. International Symposium on

Date of Conference:

14-17 Mar 1999