By Topic

Super CSPTM: WLCSP solution for memory and system LSI

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$33 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

3 Author(s)

Wafer level CSP (WLCSP) has been paid great attention due to its miniature size. It is a real chip size package from the package perspective. It is also a known good encapsulated die (KGED) from the die perspective. This means that the boundary between package and bare die becomes indistinct. It sometimes referred to as a `packageless' package. It is no longer meaningless to enquire whether CSP or bare die should be used since WLCSP is emerging. WLCSP is shaped by wafer level packaging (WLP) and wafer level testing (WLT). At this time, eight WLCSPs are proposed using different kinds of WLP. Three WLT are also proposed, including the authors' own technology. We developed the Super CSPTM using a unique WLP with five major processes: re-routing, metal-post forming, compression moulding, solder ball placing and dicing. This package allows a system designer to layout a motherboard at the smallest area possible. It also allows an assembly engineer to mount on a motherboard and replace from the motherboard similar to conventional CSPs, and allows a test engineer to test and burn-in much more easily than with known good die (KGD). We confirmed excellent electrical performance, package reliability, mountability, and second level packaging reliability

Published in:

Advanced Packaging Materials: Processes, Properties and Interfaces, 1999. Proceedings. International Symposium on

Date of Conference:

14-17 Mar 1999