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Direct-write fabrication of integrated, multilayer passive components

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3 Author(s)
Dimos, D. ; Sandia Nat. Labs., Albuquerque, NM, USA ; King, B.H. ; Yang, P.

The need for advanced electronic components and packages with smaller size, greater functionality, and enhanced reliability requires the ability to integrate electronic ceramics in complex 3D architectures. However, traditional tape casting and screen printing approaches are poorly suited to the requirements of rapid prototyping and small-lot manufacturing. To address this need, we are developing a direct-write approach for fabrication of highly integrated, multilayer components using a micropen to deposit slurries in precise patterns. This approach provides the ability to fabricate multifunctional, multimaterial integrated components (MMICCs) quickly and easily. Commercial ceramic and metal thick films can be used directly in the system, as can filled polymer thick-film pastes. With this system, we have made custom resistor networks, integrated RC filters, flat inductors, and multi-turn voltage transformers

Published in:

Advanced Packaging Materials: Processes, Properties and Interfaces, 1999. Proceedings. International Symposium on

Date of Conference:

14-17 Mar 1999

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