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Adhesion enhancement of underfill materials by silane additives

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4 Author(s)
Qizhou Yao ; George W. Woodruff Sch. of Mech. Eng., Georgia Inst. of Technol., Atlanta, GA, USA ; Qu, J. ; Wu, J. ; Wong, C.P.

In this paper, the fracture toughness of the interfaces between epoxy-based underfill materials and various substrates is experimentally measured. A small amount of silane coupling agent is added to the base underfill to form various underfill derivatives. Double layer specimens with pre-existing interfacial cracks are made for four-point bending tests. The substrates tested include aluminum, polyimide, BCB, and printed wiring boards (FR-4) with solder mask. The measurements are qualitatively correlated to each silane additive. Although the purpose of adding silane additives was to enhance the adhesion, it is found that the enhancement of interfacial toughness depends greatly on the type of substrate. The results of this study have important implications for flip-chip reliability, where interfacial cracking is one of the major failure modes

Published in:

Advanced Packaging Materials: Processes, Properties and Interfaces, 1999. Proceedings. International Symposium on

Date of Conference:

14-17 Mar 1999