Cart (Loading....) | Create Account
Close category search window
 

Development of solderless joining technologies using conductive adhesives

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

5 Author(s)
Takezawa, H. ; Matsushita Electr. Ind. Co. Ltd., Japan ; Itagaki, M. ; Mitani, T. ; Bessho, Y.
more authors

A solderless joining technique using a new Ni-type conductive adhesive was developed. First, the electrical performance was evaluated using a practical module. The delay time and output voltage of a hybrid IC (HIC) module assembled using the conductive adhesive were equivalent to that using standard eutectic solder. Secondly, the joining reliability was examined using an area array package. No electromigration was observed at any joint in the temperature-humidity bias (THB) test (85°C, 85%RH, DC 5 V, 1000 hr). A ceramic chip scale package (CSP-C) mounted on an FR-4 motherboard using this conductive adhesive showed 5 times longer lifetime than that using standard eutectic solder in temperature cycling tests (-40 to 125°C). Additional lifetime extension was attained through change in the packaging structure

Published in:

Advanced Packaging Materials: Processes, Properties and Interfaces, 1999. Proceedings. International Symposium on

Date of Conference:

14-17 Mar 1999

Need Help?


IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.