Referenced Items are not available for this document.
A solderless joining technique using a new Ni-type conductive adhesive was developed. First, the electrical performance was evaluated using a practical module. The delay time and output voltage of a hybrid IC (HIC) module assembled using the conductive adhesive were equivalent to that using standard eutectic solder. Secondly, the joining reliability was examined using an area array package. No electromigration was observed at any joint in the temperature-humidity bias (THB) test (85°C, 85%RH, DC 5 V, 1000 hr). A ceramic chip scale package (CSP-C) mounted on an FR-4 motherboard using this conductive adhesive showed 5 times longer lifetime than that using standard eutectic solder in temperature cycling tests (-40 to 125°C). Additional lifetime extension was attained through change in the packaging structure
Published in:
Advanced Packaging Materials: Processes, Properties and Interfaces, 1999. Proceedings. International Symposium on
Date of Conference: 14-17 Mar 1999
- Page(s):
- 11 - 15
- Meeting Date :
- 14 Mar 1999-17 Mar 1999
- Print ISBN:
- 0-930815-56-4
- INSPEC Accession Number:
- 6364403
- Conference Location :
- Braselton, GA
- Digital Object Identifier :
- 10.1109/ISAPM.1999.757279
- Product Type:
- Conference Publications
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