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WAVETM technology for wafer level packaging of ICs

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1 Author(s)
Fjelstad, J. ; Tessera Inc., San Jose, CA, USA

Wide area vertical expansion (WAVE) technology promises to provide a relatively easy method for cost effectively interconnecting ICs while still on the wafer. Based on concepts that allow for the mass assembly and production of compliant packages on the wafer, this important new technology is described in terms of the process and device, and the implications and future directions of the technology are examined

Published in:

Electronics Packaging Technology Conference, 1998. Proceedings of 2nd

Date of Conference:

8-10 Dec 1998