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EBGA: high frequency electrical characterization and the influence of substrate design parameters on package performance

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5 Author(s)
Y. Qiu ; Inst. of Microelectron., Singapore ; M. K. Iyer ; K. C. Chong ; T. L. Zhang
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Thermally enhanced ball grid array (EBGA) packages are studied for their electrical performance and the results are reported in this paper. The electrical parasitics of these EBGA packages are extracted in the frequency domain. A performance comparison between EBGA packages considering their different design parameters has been conducted and is reported here. The resonance issues related to the metal heat spreader are also discussed

Published in:

Electronics Packaging Technology Conference, 1998. Proceedings of 2nd

Date of Conference:

8-10 Dec 1998