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Low temperature cofired ceramic (LTCC) for wireless applications

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6 Author(s)
Consolazio, S. ; Northrop Grumman Corp., Rolling Meadows, IL, USA ; Nguyen, K. ; Biscan, D. ; Vu, K.
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This paper discusses the design and radiofrequency (RF)/microwave performance of low temperature cofired ceramic (LTCC) substrate technology for use in wireless applications. The advantages of multi-layer LTCC technology with integral embedded passives are clearly shown with wireless subsystem package designs in various formats including ball grid array (BGA) and low temperature cofired ceramic on metal (LTCC-M).

Published in:

Technologies for Wireless Applications, 1999. Digest. 1999 IEEE MTT-S Symposium on

Date of Conference:

21-24 Feb. 1999