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Common and differential crosstalk characterization on the silicon substrate

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2 Author(s)
Eisenstadr, W.R. ; Dept. of Electr. Eng., Florida Univ., Gainesville, FL, USA ; Bockelman, D.E.

Integrated circuit pad-to-pad crosstalk characterization structures were fabricated and measured over a 8000 μm×2500 μm area using Al pads on a silicon substrate. The structures were tested by a pure-mode network analyzer to yield common- and differential-mode crosstalk at 1 and 2 GHz. Differential-mode signals introduce far less substrate noise. This novel technique can characterize substrate noise levels near sensitive radio frequency (RF) and microwave circuits

Published in:
Microwave and Guided Wave Letters, IEEE  (Volume:9 ,  Issue: 1 )

Date of Publication: Jan 1999

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