By Topic

Low pressure plasma immersion ion implantation of silicon

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

4 Author(s)
Zhi-Neng Fan ; Dept. of Phys. & Mater. Sci., City Univ. of Hong Kong, Kowloon, Hong Kong ; Qing-Chuan Chen ; Chu, P.K. ; Chan, Chung

Mono-energetic plasma immersion ion implantation (PIII) into silicon can be attained only under collisionless plasma conditions. In order to reduce the current load on the high voltage power supply and modulator and sample heating caused by implanted ions, the plasma pressure must be kept low (<1 mtorr). Low pressure PIII is therefore the preferred technique for silicon PIII processing such as the formation of silicon on insulator. Using our model, we simulate the characteristics of low pressure PIII and identify the proper process windows of hydrogen PIII for the ion-cut process. Experiments are conducted to investigate details in three of the most important parameters in low pressure PIII: pulse width, voltage, and gas pressure. We also study the case of an infinitely long pulse, that is, dc PIII

Published in:

Plasma Science, IEEE Transactions on  (Volume:26 ,  Issue: 6 )