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Evaluation of Pb-free solders for adaptability to various soldering processes

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3 Author(s)
Tsunematsu, Y. ; Production Eng. Center, Omron Corp., Shiga, Japan ; Tanigami, M. ; Hirano, M.

In this paper, the authors evaluated the efficiency and productivity of an SMT and iron-machine soldering process using Sn-Ag-Cu type solders. This solder is superior to conventional ones in terms of strength, heat fatigue resistance and toughness. The results obtained are as follows: (1) in SMT processes using Sn-Ag-Cu type solders, the quality of products and efficiency obtained are similar to conventional solders, when small electric parts are selected; and (2) in iron-machine soldering processes, Sn-Ag-Cu solder is similar to conventional solders when the iron temperature is high

Published in:

Environmentally Conscious Design and Inverse Manufacturing, 1999. Proceedings. EcoDesign '99: First International Symposium On

Date of Conference:

1-3 Feb 1999

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