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Active disassembly of bonded wafers

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2 Author(s)
Kasa, D. ; Res. Center for Adv. Sci. & Technol., Tokyo Univ., Japan ; Suga, T.

In this paper, the new concept of design for disassembly, “active disassembly” is discussed. This concept proposes that products should have some structures or actuators to contribute to the disassembly themselves. A simple model of active disassembly is also considered. The model is two Si wafers bonded with water and they will be debonded when the water, which exists between two wafers, is heated and evaporates. The amounts of water required to separate the bond are estimated

Published in:

Environmentally Conscious Design and Inverse Manufacturing, 1999. Proceedings. EcoDesign '99: First International Symposium On

Date of Conference:

1-3 Feb 1999