By Topic

Importance of rapid photothermal processing in defect reduction and process integration

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$33 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

6 Author(s)
R. Singh ; Dept. of Electr. & Comput. Eng., Clemson Univ., SC, USA ; V. Parihar ; Yuanning Chen ; K. F. Poole
more authors

The smaller dimension devices demand a constant reduction in microscopic and macroscopic defects. To be able to meet the demands of the next-generation integrated circuits (IC's), we need to develop processing techniques that can increase performance, reliability and yield. Defect reduction forms the first important goal in this direction. We have identified stress as a good indicator of the defects generated during processing. Rapid photothermal processing is demonstrated as a new thermal process that can effectively replace furnace processing and rapid thermal processing. Considering various process constraints, we have presented a model for process optimization. This approach would lead to improvements in performance, reliability and yield, while reducing processing temperature and processing time. Experimental results showing the effectiveness of rapid photothermal processing are also presented

Published in:

IEEE Transactions on Semiconductor Manufacturing  (Volume:12 ,  Issue: 1 )