Cart (Loading....) | Create Account
Close category search window
 

Processing-adhesion relations for die attach adhesives and underfill resins

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

2 Author(s)
Taweeplengsangsuke, J. ; Mater. Res. Center, Lehigh Univ., Bethlehem, PA, USA ; Pearson, R.A.

Adhesion is a major consideration in the quality and reliability of new packaging technologies. In PQFPs, adhesive failure is often seen between the die attach adhesive and copper bond pad. In the case of flip chip technology, delamination is often seen between the underfill resin and organic passivation layer. Some of these failures may be attributed to process, i.e. improper cure schedules. Previous work on adhesion-processing relationships for die attach adhesives in PQFPs led to the development of bondability diagrams for isothermal cure conditions, which identified various phenomena that influenced the adhesive bond strength. Similar adhesion-processing relationships can be developed for underfill resins used in flip-chip packaging. However, underfill resins are seldom processed under isothermal conditions and one must also consider the flow process, which was not a concern for die attach adhesives. Underfill material adhesion properties and flow characteristics are the dominant factors that determine the number of cycles to failure of flip-chip packages. Clearly, understanding the cure behavior of polymeric adhesives should provide a valuable insight on delamination and interfacial failure. The purpose of this work is to study the nonisothermal cure behaviour of die attach adhesives and underfill resins in attempt to understand the relationships between processing conditions and bond strength

Published in:

Adhesive Joining and Coating Technology in Electronics Manufacturing, 1998. Proceedings of 3rd international Conference on

Date of Conference:

28-30 Sep 1998

Need Help?


IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.