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Advanced packaging and substrate technology using conductive adhesives

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1 Author(s)
Eda, K. ; Device Eng. Dev. Center, Matsushita Electr. Ind. Co. Ltd., Osaka, Japan

Packaging and substrate technology using conductive adhesives matches the trend for production of electronic equipment which is smaller, lighter and less expensive with high performance. Flexible interconnection using conductive adhesives seems a key technology for relaxation of the thermal stresses between the assembly elements in comparison with rigid interconnections such as solder joints. In this paper, packaging and substrate technologies using conductive adhesives, stud bump bonding (SBB) and ALIVH (any layer inner via hole) high density wiring board, are discussed

Published in:

Adhesive Joining and Coating Technology in Electronics Manufacturing, 1998. Proceedings of 3rd international Conference on

Date of Conference:

28-30 Sep 1998