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Deformation study of the PCB during the flip chip assembly process using anisotropically conductive adhesive (ACA) as a bonding agent

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5 Author(s)
Pinardi, K. ; Chalmers Univ. of Technol., Goteborg, Sweden ; Liu, J. ; Haug, R. ; Treutler, C.
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In this work, the finite element method is used to simulate the flip chip assembly process using anisotropically conductive adhesive bonding. Since the structure is complex and consists of composite materials, we first study different models of the PCB substrate, which lead to different results in the numerical calculations. The stress during the assembly process is also discussed. We give preliminary results in optimisation of the stress generated by varying process parameters such as temperature and force

Published in:

Adhesive Joining and Coating Technology in Electronics Manufacturing, 1998. Proceedings of 3rd international Conference on

Date of Conference:

28-30 Sep 1998