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A comparison of CMOS chip to chip interconnections: vertical optical through-Si links versus high density electrical interconnect

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4 Author(s)
M. Brooke ; Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA ; N. K. Jokerst ; S. W. Bond ; D. S. Wills

High density (HDI) electrical interconnections and vertical optoelectronic interconnections (OE) through-Si links for 3D computational systems have been modeled, and compared and contrasted in the areas of latency, size, and power dissipation. Based upon STA Roadmap projections, which indicate interconnection as a challenge area for coming generations of electronics, optoelectronics may serve a role in chip to chip interconnections for massively parallel computational systems

Published in:

Lasers and Electro-Optics Society Annual Meeting, 1998. LEOS '98. IEEE  (Volume:2 )

Date of Conference:

3-4 Dec 1998