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RF and mechanical characterization of flip-chip interconnects in CPW circuits with underfill

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5 Author(s)
Zhiping Feng ; Center for Adv. Manuf. & Packaging of Microwave, Opt., & Digital Electron., Colorado Univ., Boulder, CO, USA ; Wemge Zhang ; Bingzhi Su ; K. C. Gupta
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RF characterization of flip-chip interconnects in coplanar waveguide (CPW) circuits with underfill is reported. The scattering-parameters have been measured up to 40 GHz for GaAs CPW through-line chips flip-chip mounted on an alumina substrate with and without an underfill epoxy. A lumped-element model of flip-chip interconnect has been developed for flip-chip assemblies with and without epoxy. Fatigue life of flip-chip assemblies has been computed for different chip sizes and substrates. The results show feasibility of using underfill encapsulant in microwave/millimeter-wave frequency range

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IEEE Transactions on Microwave Theory and Techniques  (Volume:46 ,  Issue: 12 )