By Topic

Dynamics of an ultrasonic transducer used for wire bonding

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

4 Author(s)
Or, S.W. ; Dept. of Appl. Phys., Hong Kong Polytech. Univ., Kowloon, Hong Kong ; Chan, H.L.W. ; Lo, V.C. ; Yuen, C.W.

The vibration displacement distributions along a transducer used in ultrasonic wire bonding were measured using a heterodyne interferometer, and many nodes and anti-nodes were found. A mechanical finite element method (FEM) was used to compute the resonant frequencies and vibration mode shapes. The displacement distributions of the dominant 2nd axial mode agreed well with the measured values. Undesirable nonaxial modes, including the higher order flexural and torsional modes, also were excited at frequencies very close to the working frequency (2nd axial mode) of the transducer. Hence, the measured displacements were the resultant of all the allowable modes being excited. However, the excitation of these nonaxial modes were small enough not to affect the formation of consistent and high quality wire bonds. Results of the present study were used to determine a suitable location for installing a piezoelectric sensor to monitor the bond quality.

Published in:

Ultrasonics, Ferroelectrics, and Frequency Control, IEEE Transactions on  (Volume:45 ,  Issue: 6 )