Referenced Items are not available for this document.
Summary form only given. We have demonstrated an 8x8 VCSEL array flip-chip bonded to a dummy silicon chip that mimics the real CMOS driver IC by using Al metal lines and contact pads. All the bonded devices operated reliably, showing only a small variation in wavelength, threshold current and power output across the array. This demonstrates the suitability of this bonding technique for the integration of VCSEL arrays with high speed Si-based CMOS driver ICs
Published in:
Lasers and Electro-Optics Society Annual Meeting, 1998. LEOS '98. IEEE
(Volume:1
)
Date of Conference: 1-4 Dec 1998
- Page(s):
- 166 - 167 vol.1
- Meeting Date :
- 01 Dec 1998-04 Dec 1998
- Print ISBN:
- 0-7803-4947-4
- INSPEC Accession Number:
- 6324813
- Conference Location :
- Orlando, FL
- Digital Object Identifier :
- 10.1109/LEOS.1998.737783
- Product Type:
- Conference Publications
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