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Flip-chip bonding of VCSEL arrays with silicon driver chips for high speed data links

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7 Author(s)
Koelle, U. ; Center for Solid State Electron. Res., Arizona State Univ., Tempe, AZ, USA ; Johnson, S.R. ; Kelkar, P. ; Turpin, R.
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Summary form only given. We have demonstrated an 8x8 VCSEL array flip-chip bonded to a dummy silicon chip that mimics the real CMOS driver IC by using Al metal lines and contact pads. All the bonded devices operated reliably, showing only a small variation in wavelength, threshold current and power output across the array. This demonstrates the suitability of this bonding technique for the integration of VCSEL arrays with high speed Si-based CMOS driver ICs

Published in:

Lasers and Electro-Optics Society Annual Meeting, 1998. LEOS '98. IEEE  (Volume:1 )

Date of Conference:

1-4 Dec 1998