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Influence of the device package on the results of CDM tests-consequences for tester characterization and test procedure

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2 Author(s)
Brodbeck, T. ; Siemens AG, Munich, Germany ; Kagerer, A.

The results of CDM device level tests-opposite to SDM-are strongly influenced by the device packages. An investigation of different types of devices (technology and package) shows that the CDM withstand voltage depends on the peak current of the discharge current waveform and not on the charge which is stored on the device after charging. This information has important consequences for tester characterization and the test procedure. Furthermore, peak current investigation gives a chance to extrapolate CDM results from one specific package to other packages and even perhaps for SDM/CDM correlation.

Published in:
Electrical Overstress/Electrostatic Discharge Symposium Proceedings, 1998

Date of Conference: 6-8 Oct. 1998

Page(s):
320 - 327
Meeting Date :
06 Oct 1998-08 Oct 1998
Print ISBN:
1-878303-91-0
INSPEC Accession Number:
6288738
Conference Location :
Reno, NV, USA
Digital Object Identifier :
10.1109/EOSESD.1998.737052
Product Type:
Conference Publications

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